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Chongqing Nord Electric Technology Co., Ltd.

Showing 11 - 20 of 95, total 10 pages        [First] [Previous] [Next] [Last]

11
piston ring surface treatment equipment
piston ring surface treatment equipment
Specification: standard
Detail: The piston ring surface treatment equipment is applicable to the surface treatment process of piston ring, such as piston ring chromium plating, FDC / FTC, phosphating, flash chromium plating, etc. Intelligent green production...

12
electroplating production line for electron components
electroplating production line for electron components
Specification: standard
Detail: The equipment is used for election components's surface treatment.for example barrel plating.Rack plating,vibration plating for tube,relay, connector etc.

13
electroplating production line
electroplating production line
Specification: standard
Detail: Applications: Automotive, electronics, machinery, hardware, home appliances, light industry, etc. Applicable scope: Applicable to zinc, nickel, gold, silver, copper, chromium, tin and other kinds of plating, iron and steel ...

14
ztj-12a mesh filling machine
ztj-12a mesh filling machine
Specification: standard
Detail: The mesh filling machine is the key process equipment for the production of regenerator. It adopts mechanical blanking mode and integrates automatic feeding, blanking mesh, debris cleaning and filling. The equipment has friend...

15
flip chip bonding machine
flip chip bonding machine
Specification: standard
Detail: The flip chip bonding machine is mainly used in the flip welding process of large-scale integrated circuit device manufacturing to complete the flip interconnection between chip and substrate, so that the package has better ci...

16
automatic chamfering machine
automatic chamfering machine
Specification: standard
Detail: Chamfering machine is one of the key equipment used in the preparation of semiconductor wafer. It is a high-precision CNC grinding chamfering machine, which is responsible for grinding the irregular shape of wafer contour into...

17
insb zone furnace with high temperature control accuracy
insb zone furnace with high temperature control accuracy
Specification: standard
Detail: The equipment uses zone melting method to purify indium antimonide and other materials, so as to obtain high purity indium antimonide and other materials for infrared ***ection devices. By locally heating the material to the m...

18
synthesis furnace for telluride semiconductor materials
synthesis furnace for telluride semiconductor materials
Specification: standard
Detail: With the increasing requirements of HgCdTe infrared focal plane devices for substrate size and the increasingly complex synthesis process, the high-pressure synthesis furnace of Telluride semiconductor materials is mainly used...

19
hgte material single crystal growth furnace
hgte material single crystal growth furnace
Specification: standard
Detail: Mercury telluride crystal materials have broad applications in the field of large array infrared ***ectors. The equipment adopts a five temperature zone thermal field structure. Through the simulation and calculation of the th...

20
rqj-200a hot cutting machine
rqj-200a hot cutting machine
Specification: standard
Detail: Hot cutting equipment is a major component of LTCC production line. It is through computer programming and machine vision to automatically and accurately control the rapid and high-precision cutting of LTCC laminated multi-lam...
Showing 11 - 20 of 95, total 10 pages        [First] [Previous] [Next] [Last]
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