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Chongqing Nord Electric Technology Co., Ltd.
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MICROELECTRONIC PACKAGING EQUIPM
Showing 1 - 6 of 6, total 1 pages [First] [Previous] [Next] [Last]
1
automatic cap sealing machine
Specification: standard
Detail: Fully automatic energy storage sealing welder is mainly used for sealing and welding of optical device shell. It is suitable for batch production of various spherical or aspheric lens TO46 and TO56 tube cap welding processes...
2
automatic multi chip flip chip eutectic mounter
Specification: standard
Detail: The fully automatic multi-chip flip-chip eutectic placement machine is suitable for one-time eutectic welding of various materials in TO-type packages.It can clamp and weld a variety of materials at one time,especially suita...
3
automatic eutectic mounter
Specification: standard
Detail: The equipment is dedicated in the automatic eutectic chip mounting of TO (in transistor shape)type laser devices. It completes the heat sink process of TO devices and the production process of LD chip mounting by an assembly f...
4
automatic parallel seam welding machine
Specification: standard
Detail: Zfh-25 automatic parallel seam welding machine is an automatic equipment, which is mainly composed of automatic feeding mechanism, prewelding system, Y seam welding head, Y seam welding head, X seam welding head, X seam weldin...
5
automatic dispensing and pasting machine
Specification: standard
Detail: This device is applied to the micro-assembly chip dot-adhesive patch process.It has the characteristics of multi thread,multi-timing,flexible process combination,complex logic and strict process control.Key technologies such a...
6
automatic lead wedge welding bonding machine
Specification: standard
Detail: The full-automatic lead wedge bonding machine mainly completes the lead bonding process in the micro-assembly, and realizes the solid electrical connection between the welding pads on the components. The device has visual prog...
Showing 1 - 6 of 6, total 1 pages [First] [Previous] [Next] [Last]
1
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